Up
8 sec
28 sec
36 sec
Film Height after 30 sec
Pressure Distribution at 0 sec
"Three-Dimensional Chemical-Mechanical Polishing Process Model by BEM", Electrochem. Soc. & Jpn, Appl. Phys. Joint Internl. Meeting, Proc. 3rd Internl. Symp. CMP in IC Device Manufacturing, 593 (1999) "A Model of Stacked Polishing Pad for 3-D CMP Simulation", Electrochem. Soc. & Jpn, Appl. Phys. Joint Internl. Meeting, Proc. 3rd Internl. Symp. CMP in IC Device Manufacturing, 625 (1999)
"A Model of Stacked Polishing Pad for 3-D CMP Simulation", Electrochem. Soc. & Jpn, Appl. Phys. Joint Internl. Meeting, Proc. 3rd Internl. Symp. CMP in IC Device Manufacturing, 625 (1999)
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